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Light weight design to get high load capability
Bus technology for infinite application control requirements
Real hand by hand programming for rapid work
High performance and excellent human machine collaboration
Good ROI to create large values for customers
Ultra thin wafer handling & transferring
Wafer thinning & separating
Wafer surface inspecting & sorting
Wafer protective film laminating & delaminating
Innovative solutions to meet the advanced package process
To provide the robotics
To provide the automations
To provide the customized equipments
To provide satisfied service
Help to create large values
